Buy Solder Mixer Suppliers – I-PULSE M20 CHIP MOUNTER MACHINE , PLACEMENT MACHINE, – RHSMT

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Buy Solder Mixer Suppliers – I-PULSE M20 CHIP MOUNTER MACHINE , PLACEMENT MACHINE, – RHSMT Detail:

IPULSE-M20 chip mounter

I-PULSE M20 CHIP MOUNTER

ipulse-m20-5

Technical parameter

Model	I-PulseM20
Board size(with buffer unused)	Min. L50 x W30mm to Max. L1,480 x W510mm*1
Board size(with input and output buffers used)	Min. L50 x W30mm to Max. L540 x W510mm
Board thickness	0.4 – 4.8mm
Board flow direction	Left to right (Std)
Board transfer speed	Max 900mm/sec
Placement speed (4 heads + 1 theta) Opt. Cond.	0.15sec/CHIP (24,000CPH)
Placement speed (4 heads + 4 theta) Opt. Cond.	0.15sec/CHIP (24,000CPH)
Placement speed (6 heads + 2 theta) Opt. Cond.	0.12sec/CHIP (30,000CPH)*2
Placement speed (4 heads + 1 theta) IPC9850	19,000CPH
Placement speed (4 heads + 4 theta) IPC9850	19,000CPH
Placement speed (6 heads + 2 theta) IPC9850	23,000CPH*2
Placement accuracy A (?+3?)	CHIP +/-0.040mm
Placement accuracy B (?+3?)	IC +/-0.025mm
Placement angle	+/-180 degrees
Z axis control	AC servo motor
Theta axis control	AC servo motor
Component height	Max 30mm*3 (Pre-placed components: max 25mm)
Applicable components	0402 to 120x90mm, BGA, CSP, connector, etc.
Component package	8 – 56mm tape (F1/F2 Feeders), 8 – 88mm tape (F3 Electric Feeders), stick, tray
Drawback check	Vacuum check and vision check
Screen language	English, Chinese, Korean, Japanese
Board positioning	Board grip unit, front reference, auto conveyor width adjustment
Component types	Max 144 types (8mm tape), 36 lanes x 4
Transfer height	900 +/- 20mm
Machine dimensions, weight	L1750xD1750xH1420mm, Approx. 1450kg
Power	3-phase 200/208/220/240/380/400/416/440V +/-10% (Transformer included), 50/60Hz
Max consumption, capacity	1.1kW, 5.9kVA
Air pressure, consumption	0.45Mpa, 50(4 heads) or 75(6 heads) L/min A.N.R.

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