Buy Solder Mixer Suppliers – I-PULSE M20 CHIP MOUNTER MACHINE , PLACEMENT MACHINE, – RHSMT

Model

I-PulseM20

Board size(with buffer unused)

Min. L50 x W30mm to Max. L1,480 x W510mm*1

Board size(with input and output buffers used)

Min. L50 x W30mm to Max. L540 x W510mm

Board thickness

0.4 – 4.8mm

Board flow direction

Left to right (Std)

Board transfer speed

Max 900mm/sec

Placement speed (4 heads + 1 theta) Opt. Cond.

0.15sec/CHIP (24,000CPH)

Placement speed (4 heads + 4 theta) Opt. Cond.

0.15sec/CHIP (24,000CPH)

Placement speed (6 heads + 2 theta) Opt. Cond.

0.12sec/CHIP (30,000CPH)*2

Placement speed (4 heads + 1 theta) IPC9850

19,000CPH

Placement speed (4 heads + 4 theta) IPC9850

19,000CPH

Placement speed (6 heads + 2 theta) IPC9850

23,000CPH*2

Placement accuracy A (?+3?)

CHIP +/-0.040mm

Placement accuracy B (?+3?)

IC +/-0.025mm

Placement angle

+/-180 degrees

Z axis control

AC servo motor

Theta axis control

AC servo motor

Component height

Max 30mm*3 (Pre-placed components: max 25mm)

Applicable components

0402 to 120x90mm, BGA, CSP, connector, etc.

Component package

8 – 56mm tape (F1/F2 Feeders), 8 – 88mm tape (F3 Electric Feeders), stick, tray

Drawback check

Vacuum check and vision check

Screen language

English, Chinese, Korean, Japanese

Board positioning

Board grip unit, front reference, auto conveyor width adjustment

Component types

Max 144 types (8mm tape), 36 lanes x 4

Transfer height

900 +/- 20mm

Machine dimensions, weight

L1750xD1750xH1420mm, Approx. 1450kg

Power

3-phase 200/208/220/240/380/400/416/440V +/-10%
(Transformer included), 50/60Hz

Max consumption, capacity

1.1kW, 5.9kVA

Air pressure, consumption

0.45Mpa, 50(4 heads) or 75(6 heads) L/min A.N.R.